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IPC standards are used worldwide. Using industry standards makes communications with your
customers and suppliers easier. Standards assist manufacturability and often incorporate industry best
practices. Get familiar with IPC standards and make your job easier!
A sample of key IPC standards is shown below. Pricing, table of contents, available formats, and
ordering information is all available at www.ipc.org/onlinestore.
DESIGN STANDARDS
IPC-2221A
Generic Standard on Printed Board Design IPC-2221A is the foundation design standard for all
documents in the IPC-2220 series. It establishes the generic requirements for the design of printed
boards and other forms of component mounting or interconnecting structures, whether single-sided,
double-sided or multilayer. Among the many updates to Revision A are new criteria for surface plating,
internal and external foil thicknesses, component placement and hole tolerances. Expanded coverage is
provided for material properties, dimensioning and tolerancing rules, and via structures as well as
updated coupon designs for quality assurance.
IPC-2222
Sectional Design Standard for Rigid Printed Boards used in conjunction with IPC-2221A, IPC-2222
establishes the specific requirements for the design of rigid organic printed boards and other forms of
component mounting and interconnecting structures. This standard applies to single-sided, double-
sided or multi-layered boards. Key concepts in this document are: rigid laminate properties,
designer/end user materials section map, and scoring parameters.
IPC-2223A
Sectional Design Standard for Flexible Printed Boards used in conjunction with IPC-2221A, IPC-2223
establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex
flexible circuits. Revision A includes updated design rules for panel sizes, hole spacing, bend radii,
shielding, palletization, nonfunctional lands, coverlayer access/spacing and conductor edge spacing.
IPC-2226
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards Designers and
manufacturers looking for the next level of guidance on building high density interconnect (HDI) boards
will welcome IPC-2226. Used in conjunction with IPC-2221A, this standard establishes requirements
and considerations for the design of high density interconnect (HDI) printed boards and its forms of
component mounting and interconnecting structures. Based on years of industry manufacturing and
design experience, the standard provides recommendations for signal, power, ground and mixed
distribution layers, dielectric separation, via formation and metallization requirements and other design
features that are necessary for HDI-advanced IC interconnection substrates. Trade-off analyses
required to match the mounting structure to the selected chip set are included.
IPC-7351A
Generic Requirements for Surface Mount Design and Land Pattern Standard. The next revision to the
industry's leading land pattern design standard is here! This popular document covers land pattern
design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs,
TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an
intelligent land pattern naming convention, zero component rotations for CAD systems, and three
separate land pattern geometries for each component that allows the user to select a land pattern
based on desired component density. Revision A now includes land pattern design guidance for lead
free soldering processes, reflow cycle and profile requirements for components, and new component
families such as numerous forms of chip array packages and "pull-back" QFN and SON devices. IPC-
7351A includes both the standard and a IPC-7351A land pattern viewer on CD-ROM from which to
access component and land pattern dimensional data. 94 pages. Released February 2007.
PRINTED BOARDS AND MATERIALS
IPC-6011
Generic Performance Specification for Printed Boards. This specification establishes the general
requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation
for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance
requirements that must be met. For use with IPC-6012 through IPC-6018.
IPC-6012B with Amendment 1
Qualification and Performance Specification for Rigid Printed Boards. This specification covers
qualification and performance of rigid printed boards, including single-sided, double-sided, with or
without plated-through holes, multilayer with or without blind/buried vias and metal core boards.
Addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of
acceptance testing and quality conformance as well as electrical, mechanical and environmental
requirements. Amendment 1 to Revision B incorporates new requirements for reduction of surface
wrap copper plating and final finish requirements for electroless nickel/immersion gold (ENIG) and
immersion silver platings. For use with IPC-6011.
IPC-6013A
Qualification and Performance Specification for Flexible Printed Boards – Includes Amendment 2
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221
and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex
multilayer. All of these constructions may include stiffeners, plated-through holes and blind/buried vias.
This document includes updated requirements for surface plating, microsection evaluations and
acceptance testing frequency. For use with IPC-6011.
IPC-A-600G
Acceptability of Printed Boards. The definitive illustrated guide to printed circuit board acceptability!
This four-color document provides photographs and illustrations of the target, acceptable and
nonconforming conditions that are either internally or externally observable on bare printed boards.
Make sure your operators, inspectors, and engineers have the most current industry consensus
information. With more than 80 new or revised photographs and illustrations, revision G provides new
coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and
expanded coverage for measling and crazing of printed boards, annular ring requirements, etchback,
foil cracks, flexible circuits, and minimum foil thickness for conductive patterns. The document
sychronizes to the acceptability requirements expressed in IPC-6012B and IPC-6013A.
IPC-4101B
Specification for Base Materials for Rigid and Multilayer Printed Boards – Includes Amendments 1 & 2
This specification covers the requirements for base materials (laminate and prepreg) for rigid or
multilayer printed boards for electrical and electronic circuits. This document contains more than 50
specification sheets and uses search terms to allow the user to find similar groups of materials from
these specification sheets. This standard provides the user with additional information and data on
printed circuit board materials that are better able to withstand the newer assembly operations
employing higher thermal exposures, including those that use lead free solders.
IPC-4562
Metal Foil for Printed Wiring Applications with Amendment 1. IPC-4562 covers the nomenclature and
requirements for metal foils used in laminate and board fabrication. Specification sheets are included to
assist buyers and suppliers in understanding and using consistent purchasing and quality criteria for
metal foils.
ELECTRONIC ASSEMBLY
IPC-J-STD-001D
Requirements for Solder Electrical and Electronic Assemblies. J-STD-001D is recognized worldwide as
the sole industry-consensus standard for soldering materials and processes. This document includes
support for lead free manufacturing, in addition to criteria for materials, methods and verification for
producing quality soldered interconnections and assemblies. The requirements for all three classes of
construction are included. Full color illustrations are provided for clarity. This standard fully
complements IPC-A-610D.
IPC-A-610D
Acceptability of Electronic Assemblies. IPC-A-610 is the most widely used electronics assembly
standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D
illustrates industry-accepted workmanship criteria for electronics assemblies through full-color
photographs and illustrations. Topics include lead free, component orientation and soldering criteria for
through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating,
and laminate requirements. This 400-page document synchronizes to the requirements expressed in
other industry consensus documents and is used with the material and process standard IPC J-STD-
001.
IPC-7095A
Design and Assembly Process Implementation for BGAs. Implementing ball grid array (BGA) and fine-
pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly,
inspection and repair personnel. This document delivers useful and practical information to anyone who
is currently using BGAs or is considering a conversion to area array packaging formats. In addition to
providing guidelines for BGA inspection and repair, IPC-7095A also addresses reliability issues and the
use of lead free joint criteria associated with BGAs. The document includes many photographs of X-ray
or endoscope illustrations to identify characteristics that the industry is experiencing in the
implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and
component types is also discussed.
Find out more at www.ipc.org today!
customers and suppliers easier. Standards assist manufacturability and often incorporate industry best
practices. Get familiar with IPC standards and make your job easier!
A sample of key IPC standards is shown below. Pricing, table of contents, available formats, and
ordering information is all available at www.ipc.org/onlinestore.
DESIGN STANDARDS
IPC-2221A
Generic Standard on Printed Board Design IPC-2221A is the foundation design standard for all
documents in the IPC-2220 series. It establishes the generic requirements for the design of printed
boards and other forms of component mounting or interconnecting structures, whether single-sided,
double-sided or multilayer. Among the many updates to Revision A are new criteria for surface plating,
internal and external foil thicknesses, component placement and hole tolerances. Expanded coverage is
provided for material properties, dimensioning and tolerancing rules, and via structures as well as
updated coupon designs for quality assurance.
IPC-2222
Sectional Design Standard for Rigid Printed Boards used in conjunction with IPC-2221A, IPC-2222
establishes the specific requirements for the design of rigid organic printed boards and other forms of
component mounting and interconnecting structures. This standard applies to single-sided, double-
sided or multi-layered boards. Key concepts in this document are: rigid laminate properties,
designer/end user materials section map, and scoring parameters.
IPC-2223A
Sectional Design Standard for Flexible Printed Boards used in conjunction with IPC-2221A, IPC-2223
establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex
flexible circuits. Revision A includes updated design rules for panel sizes, hole spacing, bend radii,
shielding, palletization, nonfunctional lands, coverlayer access/spacing and conductor edge spacing.
IPC-2226
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards Designers and
manufacturers looking for the next level of guidance on building high density interconnect (HDI) boards
will welcome IPC-2226. Used in conjunction with IPC-2221A, this standard establishes requirements
and considerations for the design of high density interconnect (HDI) printed boards and its forms of
component mounting and interconnecting structures. Based on years of industry manufacturing and
design experience, the standard provides recommendations for signal, power, ground and mixed
distribution layers, dielectric separation, via formation and metallization requirements and other design
features that are necessary for HDI-advanced IC interconnection substrates. Trade-off analyses
required to match the mounting structure to the selected chip set are included.
IPC-7351A
Generic Requirements for Surface Mount Design and Land Pattern Standard. The next revision to the
industry's leading land pattern design standard is here! This popular document covers land pattern
design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs,
TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an
intelligent land pattern naming convention, zero component rotations for CAD systems, and three
separate land pattern geometries for each component that allows the user to select a land pattern
based on desired component density. Revision A now includes land pattern design guidance for lead
free soldering processes, reflow cycle and profile requirements for components, and new component
families such as numerous forms of chip array packages and "pull-back" QFN and SON devices. IPC-
7351A includes both the standard and a IPC-7351A land pattern viewer on CD-ROM from which to
access component and land pattern dimensional data. 94 pages. Released February 2007.
PRINTED BOARDS AND MATERIALS
IPC-6011
Generic Performance Specification for Printed Boards. This specification establishes the general
requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation
for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance
requirements that must be met. For use with IPC-6012 through IPC-6018.
IPC-6012B with Amendment 1
Qualification and Performance Specification for Rigid Printed Boards. This specification covers
qualification and performance of rigid printed boards, including single-sided, double-sided, with or
without plated-through holes, multilayer with or without blind/buried vias and metal core boards.
Addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of
acceptance testing and quality conformance as well as electrical, mechanical and environmental
requirements. Amendment 1 to Revision B incorporates new requirements for reduction of surface
wrap copper plating and final finish requirements for electroless nickel/immersion gold (ENIG) and
immersion silver platings. For use with IPC-6011.
IPC-6013A
Qualification and Performance Specification for Flexible Printed Boards – Includes Amendment 2
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221
and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex
multilayer. All of these constructions may include stiffeners, plated-through holes and blind/buried vias.
This document includes updated requirements for surface plating, microsection evaluations and
acceptance testing frequency. For use with IPC-6011.
IPC-A-600G
Acceptability of Printed Boards. The definitive illustrated guide to printed circuit board acceptability!
This four-color document provides photographs and illustrations of the target, acceptable and
nonconforming conditions that are either internally or externally observable on bare printed boards.
Make sure your operators, inspectors, and engineers have the most current industry consensus
information. With more than 80 new or revised photographs and illustrations, revision G provides new
coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and
expanded coverage for measling and crazing of printed boards, annular ring requirements, etchback,
foil cracks, flexible circuits, and minimum foil thickness for conductive patterns. The document
sychronizes to the acceptability requirements expressed in IPC-6012B and IPC-6013A.
IPC-4101B
Specification for Base Materials for Rigid and Multilayer Printed Boards – Includes Amendments 1 & 2
This specification covers the requirements for base materials (laminate and prepreg) for rigid or
multilayer printed boards for electrical and electronic circuits. This document contains more than 50
specification sheets and uses search terms to allow the user to find similar groups of materials from
these specification sheets. This standard provides the user with additional information and data on
printed circuit board materials that are better able to withstand the newer assembly operations
employing higher thermal exposures, including those that use lead free solders.
IPC-4562
Metal Foil for Printed Wiring Applications with Amendment 1. IPC-4562 covers the nomenclature and
requirements for metal foils used in laminate and board fabrication. Specification sheets are included to
assist buyers and suppliers in understanding and using consistent purchasing and quality criteria for
metal foils.
ELECTRONIC ASSEMBLY
IPC-J-STD-001D
Requirements for Solder Electrical and Electronic Assemblies. J-STD-001D is recognized worldwide as
the sole industry-consensus standard for soldering materials and processes. This document includes
support for lead free manufacturing, in addition to criteria for materials, methods and verification for
producing quality soldered interconnections and assemblies. The requirements for all three classes of
construction are included. Full color illustrations are provided for clarity. This standard fully
complements IPC-A-610D.
IPC-A-610D
Acceptability of Electronic Assemblies. IPC-A-610 is the most widely used electronics assembly
standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D
illustrates industry-accepted workmanship criteria for electronics assemblies through full-color
photographs and illustrations. Topics include lead free, component orientation and soldering criteria for
through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating,
and laminate requirements. This 400-page document synchronizes to the requirements expressed in
other industry consensus documents and is used with the material and process standard IPC J-STD-
001.
IPC-7095A
Design and Assembly Process Implementation for BGAs. Implementing ball grid array (BGA) and fine-
pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly,
inspection and repair personnel. This document delivers useful and practical information to anyone who
is currently using BGAs or is considering a conversion to area array packaging formats. In addition to
providing guidelines for BGA inspection and repair, IPC-7095A also addresses reliability issues and the
use of lead free joint criteria associated with BGAs. The document includes many photographs of X-ray
or endoscope illustrations to identify characteristics that the industry is experiencing in the
implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and
component types is also discussed.
Find out more at www.ipc.org today!
Are you using IPC standards?
IPC – Association Connecting Electronics Industries® is the global trade association for the printed
board and electronics assembly industries. Accredited by the American National Standards Institute,
IPC publishes and maintains 150 active standards for every aspect of the process — from design and
data transfer to board acceptability to soldering and assembly acceptability.
IPC – Association Connecting Electronics Industries® is the global trade association for the printed
board and electronics assembly industries. Accredited by the American National Standards Institute,
IPC publishes and maintains 150 active standards for every aspect of the process — from design and
data transfer to board acceptability to soldering and assembly acceptability.